"The Terafab project is designed to produce silicon at process nodes rather than only package it, marking a significant shift in SpaceX's operations."
"A fab requires cleanroom facilities, lithography equipment that costs hundreds of millions per unit, deep semiconductor process expertise, and construction cycles that typically run five to seven years."
"The combined Bastrop and Terafab footprint would become the largest PCB and panel-level-packaging facility in North America, enhancing SpaceX's manufacturing capabilities."
"Starlink ships hardware at volumes that make per-unit silicon cost a non-issue, aligning with the strategic rationale behind the Terafab investment."
The Terafab project, alongside the existing Bastrop facility, represents a significant investment in Texas chipmaking, totaling approximately $119bn. SpaceX plans to invest $55bn in a semiconductor fabrication facility, which will differ from Bastrop's packaging operations. Terafab will produce silicon at process nodes, requiring extensive cleanroom facilities and advanced equipment. The combined facilities will include silicon fabrication, advanced packaging, PCB manufacturing, and a semiconductor failure-analysis lab, positioning them as the largest PCB and panel-level-packaging facility in North America.
Read at TNW | Business
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