SPX Technologies has positioned itself at the intersection of two of the most durable infrastructure trends of this decade, data center cooling and engineered air movement, and the capacity to capture that demand is being built right now.
Microsoft has announced progress on a new chip cooling approach that could help address one of the biggest bottlenecks in scaling AI infrastructure: heat. The company's researchers have successfully demonstrated in-chip microfluidic cooling, a system that channels liquid coolant directly into etched grooves on the back of silicon chips. Traditional cooling methods in data centers, such as cold plates, dissipate heat by transferring it through multiple material layers.
